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apds-9008 miniature surface-mount ambient light photo sensor data sheet description the apds-9008 is a low cost analog-output ambient light photo sensor in miniature chipled lead-free surface mount package. it consists of a spectrally suited photo sensor, which provides excellent responsivity that is close to the response of the human eyes, as show in figure 2. the apds-9008 is ideal for applications in which the mea- surement of ambient light is used to control display back- lighting. mobile appliances such as the mobile phones and pdas that draw heavy current from display backlight- ing will benefit from incorporating these photo sensor products in their designs by reducing power consump- tion significantly. application support information the application engineering group is available to assist you with the application design associated with apds- 9008 ambient light photo sensor module. you can con- tact them through your local sales representatives for ad- ditional details. features ? excellent responsivity - close responsivity to the human eye ? miniature chipled leadfree surface-mount package height C 0.55 mm width C 1.60 mm depth C 1.50 mm ? low sensitivity variation across various light sources ? operating temperature : -40 c to 85 c ? vcc supply 1.6 to 5.5v ? lead-free package, rohs compliance ? output linearity across wide illumination range ? high output saturation voltage applications ? detection of ambient light to control display backlighting mobile devices C mobile phones, pdas computing devices C notebooks, webpads consumer devices C tvs, video cameras, digital still camera ? automatic residential and commercial lighting management ? electronic signs and signals
2 ordering information part number packaging type package quantity apds-9008-020 tape and reel 6-pins chipled package 2500 i/o pins configuration table pin symbol description 1 vcc vcc 2 nc no connect 3 nc no connect 4 gnd ground 5 nc no connect 6 iout out vcc [1] load gnd [4] apds-9008 out [6] typical application circuit absolute maximum ratings for implementations where case to ambient thermal resistance is 50 c /w parameter symbol min. max. units storage temperature t s -40 85 c supply voltage v cc 06 v recommended operating conditions parameter symbol min. max. units conditions operating temperature t a -40 85 c supply voltage v cc 1.6 5.5 v caution: it is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by esd. figure 1. typical application circuit for apds-9008
3 electrical & optical specifications (ta=25 c) parameter symbol min. typ. max. units conditions supply current icc 42 a vcc =1.8v, lux = 100 (2) photo current (i) i_ ph1 28 40 52 a vcc =1.8v, lux = 100 (2) photo current (ii) i_ ph2 44 a vcc =1.8v, lux = 100 (1) dark current i_ dark 300 na vcc =1.8v, lux = 0 light current ratio i_ ph2 /i_ ph1 1.1 incandescent light / fluorescent light rise time tr 5 ms rl = 1kohm, lux = 100 fall time tf 5 ms r1 = 1kohm, lux=100 settling time t set 10 ms r1=2.4kohm,lux=100 peak sensitivity wavelength 565 nm propagation delay td 5 ms rl = 1kohm, lux = 100 storage delay ts 5 ms r1 = 1kohm, lux=100 saturation voltage vsat 1.5 v r1 = 100kohm, lux = 100, vcc=1.8v notes : 1. illuminance by cie standard light source (incandescent lamp) 2. fluorescence light is used as light source, however, white led is substituted in a mass production process. light measurement circuit and waveforms pin 2,3,5: nc pin 1:vcc pin 6:iout apds-9008 i_pulse td tr ts tf i_pulse vout pin 4: gnd tset vcc vout 90 % vcc pulse from pulse generator sensor output at load tset t t
4 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 -40 -20 0 20 40 60 80 100 temperature in degrees rel avg-icc 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -90 -70 -50 -30 -10 10 30 50 70 90 angle in degrees relative iout response 0.50 0.60 0.70 0.80 0.90 1.00 1.10 1.20 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3 vcc rel iout 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 -40 -20 0 20 40 60 80 100 temperature in degrees relative iout 000.0e+0 50.0e-6 100.0e-6 150.0e-6 200.0e-6 250.0e-6 300.0e-6 350.0e-6 400.0e-6 450.0e-6 0 100 200 300 400 500 600 700 800 900 1000 lux output current [a] 0 0.2 0.4 0.6 0.8 1 300 400 500 600 700 800 900 1000 wavelength in nm relative response 9008 spectral response eye response rel avg-icc vs temp at 100lux figure 2. relative spectral response vs wav elength figure 3. average iout vs lux (vcc=1.8v, t=25 c, white led source) figure 4. relative iout vs temp (vcc=1.8v, 100 lux) figure 5. relative iout vs vcc (t=25 c, 100 lux) figure 6. relative iout vs angle ( vcc=1.8v, t=25 c) figure 7. relative average icc vs temp ( vcc=1.8v, t=25 c, 100 lux)
5 0.0 0.4 0.8 1.2 1.6 2.0 0 200 400 600 800 1000 lux vout (v) r=12k r=10k r=8.2k r=6.8k r=4.7k r=1k 0.00e+00 2.00e-07 4.00e-07 6.00e-07 8.00e-07 1.00e-06 1.20e-06 1.40e-06 -40 -20 0 20 40 60 80 100 temp in degrees idark 0.50 0.60 0.70 0.80 0.90 1.00 1.10 1.20 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3 vcc relicc figure 8. relative average icc vs vcc (t=25 c, 100 lux) figure 9. dark current vs temp (vcc=1.8v) figure 10. general luminance vs typical output voltage (vcc=1.8v, t=25 c, light source = white led)
6 apds-9008 package outline
7 apds-9008 tape and reel dimension
8 moisture proof packaging no yes yes yes no no units in a sealed moisture-proof package package is opened (unsealed) parts are not recommended to be used environment less than 30 c and less than 60%rh package is opened less than 168 hours package is opened less than 15 days perform recommended baking conditions no baking is necessary all apds-9008 options are shipped in moisture proof package. once opened, moisture absorption begins. this part is compliant to jedec level 3. baking conditions: package temperature time in reel 60c 48 hours in bulk 100c 6 hours * baking should only be done once. recommended storage conditions: storage temperature 100c to 300c relative humidity below 60% rh time from unsealing to soldering: after removal from the bag, the parts should be soldered within 168 hours if stored at the recommended storage conditions. if times longer than 168 hours are needed, the parts must be stored in a dry box.
9 50 100 150 200 250 300 t-time (seconds) 25 80 120 150 180 200 230 255 0 t - temperature (c) r1 r2 r3 r4 r5 217 max 260c 60 sec to 90 sec above 217c p1 heat up p2 solder paste dry p3 solder reflow p4 cool down recommended reflow profile the reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow sol- der process. the temperature profile is divided into four process zones, each with different t/ time temperature change rates or duration. the t/ time rates or duration are detailed in the above table. the temperatures are measured at the component to printed circuit board con- nections. process zone p1 , the pc board and component pins are heated to a temperature of 150c to activate the flux in the solder paste. the temperature ramp up rate, r1, is lim- ited to 3c per second to allow for even heating of both the pc board and component pins. process zone p2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. the temperature is raised to a level just below the liquidus point of the sol- der. process zone p3 is the solder reflow zone. in zone p3, the temperature is quickly raised above the liquidus point of solder to 260c (500f) for optimum results. the dwell time above the liquidus point of solder should be between 60 and 120 seconds. this is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. the temperature is then rap- idly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. process zone p4 is the cool down after solder freeze. the cool down rate, r5, from the liquidus point of the solder to 25c (77f) should not exceed 6c per second maxi- mum. this limitation is necessary to allow the pc board and component pins to change dimensions evenly, put- ting minimal stresses on the component. it is recommended to perform reflow soldering no more than twice. process zone symbol t maximum t/time or duration heat up p1, r1 25c to 150c 3c/s solder paste dry p2, r2 150c to 200c 100s to 180s solder reflow p3, r3 p3, r4 200c to 260c 260c to 200c 3c/s -6c/s cool down p4, r5 200c to 25c -6c/s time maintained above liquidus point , 217c > 217c 60s to 120s peak temperature 260c - time within 5c of actual peak temperature >255c 20s to 40s time 25c to peak temperature 25c to 260c 8mins
10 appendix a. smt assembly application note 1.0 solder pad, mask and metal stencil aperture figure a1. stencil and pcba 1.1 recommended land pattern figure a2. recommended land pattern metal stencil for solder paste printing stencil aperture solder mask land pattern pcba 0.4 0.4 0.2 0.9 0.3 c l 0.45 0.4 1.2 recommended metal solder stencil aperture it is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. aperture open- ing for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm (as per land pattern). this is to ensure adequate printed solder paste volume and no shorting. figure a3. solder stencil aperture 1.3 adjacent land keepout and solder mask areas adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. there should be no other smd components within this area. the minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. note: wet/liquid photo-imageable solder resist/mask is recommended. figure a4. adjacent land keepout and solder mask areas 1.7 0.11 1.6 unit: mm aperture opening mounting center unit: mm 0.2 min. 2.7 2.6
11 z l t d1 wd top view d2 d1 apds-9008 light receving area table 1 and figure b3 below show the recommended dimensions of the window. these dimension values are based on a window thickness of 1.0mm with a refractive index 1.585. figure b3. recommended window dimensions wd: working distance between window front panel & apds-9008 d1: window diameter t: thickness l: length of light pipe d2: light pipe diameter z: distance between window rear panel and apds-9008 table 1. recommended dimension for optical window all dimensions are in mm wd (t+l+z) flat window (l=0.0) flat window with light pipe (d2=1.5; z =0.5) zd1d1l 1.5 0.5 2.25 - - 2.0 1.0 3.25 - - 2.5 1.5 4.25 - - 3.0 2.0 5.00 2.5 1.5 the window should be placed directly on top of the photo sensor to achieve better performance and if a flat window with a light pipe is used, dimension d2 should be 1.5mm to optimize the performance of apds-9008. flat appendix b. optical window design for apds-9008 1.0 optical window dimensions to ensure that the performance of the apds-9008 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. there is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the apds-9008. this minimum dimension that is recommended will en- sure at least a 35 light reception cone. if a smaller window is required, a light pipe or light guide can be used. a light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total in- ternal reflection to focus the light. the thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. figure b1 and b2 illustrate the two types of window that we have recommended which could either be a flat win- dow or a flat window with light pipe. figure b1. window size determination for flat window figure b2. window design of flat window with light guide
2.1 optical window material the material of the window is recommended to be poly- carbonate. the surface finish of the plastic should be smooth, without any texture. the recommended plastic material for use as a window is available from bayer ag and bayer antwerp n. v. (europe), bayer corp.(usa) and bayer polymers co., ltd. (thailand), as shown in table 2. table 2. recommended plastic materials material number visible light transmission refractive index makrolon lq2647 87% 1.587 makrolon lq3147 87% 1.587 makrolon lq3187 85% 1.587 appendix c . general application guide for apds-9008 the apds-9008 is a low cost analog-output ambient light photo sensor whose spectral response closely emulates the human eyes. apds-9008 consists of a photo sen- sor that is able to produce a high gain photo current to a sufficient level that can be converted to voltage with a standard value of external resistor. apds-9008 can easily be integrated into systems that use adc input which is available for sampling of the external source, as shown in figure c1 below. the amount of converted voltage, vout, is mainly depen- dant proportionally on the photo current which generated by the brightness of the light shone on the photo sensor and the load resistor used, rl. increasing the brightness of the light or/and the load resistor will increase the output voltage. brightness is measured as lux unit, which describes how intense a light source that our eyes perceive. lux meter is the equipment for lux measurement. light sources with the same lux level appear at the same brightness to the human eyes. for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. av02-1169en - november 7, 2008 apds - 9008 a / d micro - con t ro ll er vcc ligh t source 1 6 vou t rl c 4 2,3,5 nc figure c1. configuration of apds-9008 selection of the load resistor rl will determine the amount of current-to-voltage conversion in the circuit. light source e.g. fluorescent light consists of ac noise fre- quency of about 100hz. a capacitor of 10uf, which act as a low-pass filter, is recommended to add in parallel with the load resistor to reduce the ripples.

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